Unit News
Feng Chia Student Recognized Again by Apple! Jui-Lin Yu Wins Swift Student Challenge with Environmental Story App
2025.04.16
Apple recently announced the winners of the 2025 Swift Student Challenge, with only 350 young developers worldwide receiving the honor. Among them, three were from Taiwan, including Jui-Lin Yu, a graduate of Feng Chia University's Department of Computer Science and Information Engineering. Yu impressed the judges with his interactive app "Forest Guardian," which integrates environmental issues with programming, showcasing his persistence and determination after three attempts at the competition.
Double Honors: Professor Jyh-Horng Chou of the Department of Electrical Engineering Appointed as Chair Professor at Feng Chia University and Awarded AAIA Fellow
2025.03.27
Distinguished Professor Jyh-Horng Chou of the Department of Electrical Engineering has received multiple accolades! Following last year's award of the "IEEE Fellow," one of the highest honors in the global electrical and electronic engineering field, he has been appointed as Chair Professor at Feng Chia University this semester. Recently, he added another honor by being awarded the title of "Fellow" by the Asia-Pacific Artificial Intelligence Association (AAIA), recognizing his outstanding achievements in the field of AI applications, particularly in Intelligent IoT. To date, AAIA has selected 2,068 fellows globally, with only 31 scholars from Taiwan, highlighting his esteemed position in the international academic community. Receiving two prestigious honors at the beginning of 2025 is truly well-deserved.
Feng Chia University Student Team Wins Championship at the 20th Industrial Robot Competition, Showcasing Excellence in AI Autonomous Vehicle Technologies
2025.03.10
At the 20th Industrial Robot Competition in 2025, the Ai Club of Feng Chia University delivered an exceptional performance, achieving outstanding results in the AI Autonomous Vehicle Racing (College Division).
Feng Chia University’s 10 Engineering Programs All Pass 2025 IEET Accreditation
2025.02.11
The Institute of Engineering Education Taiwan (IEET) officially announced on January 17 that 10 academic programs at Feng Chia University successfully passed the 2025 engineering education accreditation review. These include the Department of Automatic Control Engineering, Department of Communications Engineering, Department of Electronic Engineering, and Department of Electrical Engineering under the College of Information and Electrical Engineering, as well as the Department of Chemical Engineering, Department of Photonics, Master's Program of Electro-acoustics, Bachelor Program in Precision System Design, Master's Program of Green Energy Science and Technology, and Ph.D. Program of Mechanical and Aeronautical Engineering under the College of Engineering and Science. This achievement highlights Feng Chia University’s excellence in engineering education and provides a strong foundation for cultivating industry professionals with global competitiveness.
Taiwan's First! Feng Chia University Partners with Fraunhofer Society to Establish Innovation Platform
2024.10.28
Feng Chia University has been tirelessly promoting international cooperation and has collaborated with the Fraunhofer Institute for Surface Engineering and Thin Films (Fraunhofer IST) for nearly a decade. During this period, the collaboration projects included bilateral industry-academia cooperation, joint seminars and forums, the establishment of joint laboratories, personnel exchanges, and the joint proposal of cooperation plans. With fruitful cooperation results, the world's largest applied research organization, the Fraunhofer Society, and Feng Chia University agreed to expand their cooperation and jointly establish an international innovation platform on campus, named the Fraunhofer Innovation Platform for Surface and Production Engineering for Optical and Electrical Systems at Feng Chia University (FIP-SPE@FCU). The platform was officially inaugurated today (28th), marking the first Fraunhofer FIP international innovation applied research organization in Taiwan.
22 Faculty Members from Feng Chia University Ranked Among the World’s Top 2% Scientists
2024.09.25
The World’s Top 2% Scientists list for 2023, compiled by Stanford University using Scopus citation data, was released in September 2024. Feng Chia University achieved an impressive milestone with 28 entries, including 18 faculty members named in the Career-Long Impact List (1960–2023) and 10 faculty members named in the 2023 Annual Impact List. Notably, six professors were listed in both categories, demonstrating the university’s strong global research influence.
Taiwania 2 Supercomputer Empowers Feng Chia University Students to Perform Full‑Parameter Fine‑Tuning of Large Language Models
2024.08.07
Feng Chia University has been collaborating with ASUS and TAIA (Taiwan AI Cloud) to launch an AI Talent Development Program. TAIA, jointly established by the National Center for High‑performance Computing (NCHC) under the National Science and Technology Council (NSTC) and the ASUS Group, is a major national AI infrastructure project featuring the “Formosa Foundation Model,” built on extensive Traditional Chinese datasets.
A Moment Earned by Skill: Feng Chia University’s Yan‑Ting Kuo Wins Second Place Nationwide in Cloud Computing
2024.07.25
Students from the Department of Information Engineering and Computer Science at Feng Chia University delivered outstanding performances. Yan‑Ting Kuo won second place nationwide in the Cloud Computing Category, while Wei‑Zhen Yu and Qiu‑Tong Liu received Merit Awards in the Cybersecurity Category.
Feng Chia University’s Yan‑Ting Kuo Wins Second Place Nationwide in Cloud Computing at the 8th Mobile Application Innovation Contest
2024.07.25
This year’s competition reached a record scale, attracting 583 teams from 79 colleges and universities, with a total of 1,017 student participants. The winning work will represent Taiwan at the 2024 Greater China Mobile Application Innovation Contest in November, showcasing Taiwanese students’ outstanding capabilities in technological innovation.